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魏素凤

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【省】Stabilization of Nanocrystalline Copper by Tantalum Grain Boundary Segregation

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Affiliation of Author(s):材料科学工程学院

Teaching and Research Group:金属材料基础实验教学中心

Journal:Open Journal of Physical Chemistry

Funded by:国家自然科学基金项目

Key Words:Nanocrystalline, Segregation, Creep, Nanoindentation, Grain Growth, Annealing

Abstract:Nanocrystalline Cu-Ta alloy films were deposited on glass slides by magnetron sputtering. Microstructure characterization proved that most of the tantalum atoms are segregated in the grain boundaries. Nanoindentation creep measurements were performed on it to uncover the stability mechanism of grain boundary segregation on nanocrystalline materials. It is found that segregation can effectively slow down the creep strain rate and the grain boundary activities. The suppressed grain boundary activities endow the alloy with a stable microstructure during plastic deformation and annealing.

Co-author:胡新明,刘向雷,王国勇

First Author:weisufeng

Indexed by:Journal paper

Volume:11

Page Number:1

ISSN No.:2162-1977

Translation or Not:no

Date of Publication:2021-08-03

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