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段振鑫

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一种具有两级增强三维网状结构的TiAl基复合材料及其制备方法

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Type of Patent:Invent

State of Patent:Authorized patents

Service Invention or Not:no

Authorization Date:2024-10-22

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Copyright: Changchun University of Technology Ji ICP No. 05002091 Address: No. 2055 Yan'an Street, Changchun City, Jilin Province Post Code: 130012
Technical support: Information Technology Construction Office (Information Technology Center)

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