【SCI通讯】Modeling and Investigation of Minimum Chip Thickness for Silicon Carbide during Quasi-intermittent Vibration Assisted Swing Cutting
发布时间:2024-03-22 点击次数:
发表刊物:The International Journal of Advanced Manufacturing Technology
论文类型:期刊论文
卷号:127
是否译文:否
发表时间:2023-04-05
收录刊物:SCI