【SCI通讯】Modeling and Investigation of Minimum Chip Thickness for Silicon Carbide during Quasi-intermittent Vibration Assisted Swing Cutting
发布时间：2024-03-22 点击次数：
发表刊物：The International Journal of Advanced Manufacturing Technology
论文类型：期刊论文
卷号：127
是否译文：否
发表时间：2023-04-05
收录刊物：SCI